Description
The High-Suction Desoldering Pump provides powerful solder extraction with an easy-to-clean transparent tube and a compact, one-hand operation design, making it ideal for electronics repair.
Features:
High Suction Power
Piston with double O-rings avoids the air leakage and maximizes suction power.
Suction Capability: 32cm-Hg, quick and easy to clean solder residues.
Easy Clearance
Transparent tube is easy to check the volume of solder residues.
Replacement tip with heat-resistant Teflon isn’t easy to be out of shape.
User-Oriented Design
Nonslip handle design to hold the pump tightly.
Compact size for one hand operation.
Ideal desoldering tool to rework or repair circuit boards.
Specifications:
| Material | Suction capacity | OAL. (mm) | Individual packing |
| PC | 32cm-Hg | 210 | Blister card |








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